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Global 200mm fabs to reach record high capacity by 2026, says SEMI

Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm fabs as the industry reaches a record high of more than 7.7 million wafers per month, according to SEMI.

Intel Displays Granite Rapids CPUs as Specs Leak: Five Chiplets

Intel this week showcased its 6th Generation Xeon Scalable 'Sapphire Rapids' processors as part of its advanced packaging prowess demonstration. The multi-tile datacenter CPU are due to arrive in the first half of 2024 and the company is sampling them with its customers. Meanwhile, hardware leaker @Yuuki_AnS this week revealed specifications of ES1 samples of these processors.

Taiwan-made SSDs enter space supply chain, aiding NASA lunar missions

The Overseas Community Affairs Council (OCAC) released a press statement applauding K. S. Pua, the CEO of Phison Electronics, for his recognition by the American aerospace company Skycorp. This recognition is attributed to Phison's development of a 4TB Solid State Drive (SSD), which underwent testing aboard the International Space Station in 2022 and holds potential for future utilization in NASA's lunar missions.

Kingston FURY™ Beast DDR4 RGB. Unleash your Performance

Kingston FURY™ Beast DDR4 RGB* memory upgrades the style and performance of any system. Featuring stunning RGB lighting to complement the sleek black heat spreader and impressive speeds up to 3733MT/s. Choose between IntelĀ® XMP Certified & XMP-Ready profiles, Ready for AMD Ryzen™, or go for Plug N Play automatic overclocking at 2666MT/s** to get the boost you need for work and play.

AMD EPYC ‘Siena’ Specification Leak: Up to 64 Cores

Renowned hardware leaker @momomo_us has published what seems to be specifications of AMD's upcoming EPYC 8004-series 'Siena' processors. The new Zen 4-based CPUs are projected to hit the market later this year or early next year and address lower-power servers that may not need the highest performance, such as those used for edge and telecom applications.

Micron Preps 32Gb DDR5 Chips, Opens Door to 1TB Modules

Micron was the first company to introduce 24Gb DDR5 memory devices as well as start shipping actual modules on their base last fall. As it turns out, as part of Micron's HBM3 Gen2 announcement, the company wants to maintain the lead and is prepping to mass produce 32Gb DDR5 ICs as well high-capacity memory modules in the first half of 2024, the company revealed today.

Intel Resumes Shipping Xeon MCC Processors After Bug is Mitigated

Intel has confirmed that it had paused shipments of some of its fourth-gen Xeon Sapphire Rapids processors due to a newly-discovered bug, but it hadn't set a specific date for shipments to resume. The company has now issued a statement indicating that it has developed a firmware fix and has resumed shipments.

Cezanne Lives On: Ryzen 7 5700 Surfaces Without Integrated Graphics

AMD's Zen 4 processors may compete with the best CPUs. Nevertheless, the chipmaker hasn't moved on from Zen 3. As VideoCardz spotted, Gigabyte has listed an unannounced Zen 3 chip from the Ryzen 5000G (Cezanne) days. The Ryzen 7 5700 first popped up last year, but this is the first time it's been part of an official listing.