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Third Chinese company begins HBM memory production for AI processors

Chinese memory makers are slowly but surely adopting the production of high-bandwidth memory (HBM) for AI and HPC processors. This week, Nikkei reported that a third China-based producer, Tongfu Microelectronics, began sampling its HBM products with select customers. Such action indicates that the ecosystem required to make this type of memory is developing. Interestingly, AMD is a major client and shareholder of Tongfu.

Huawei preps new Kunpeng CPU with HBM — unannounced Kunpeng Arm server chip matches Intel and AMD’s tech

New e-mails from Huawei engineers regarding Linux kernel development suggest that HiSilicon - Huawei's chip subsidiary - is prepping a new Kunpeng SoC with HBM (High Bandwidth Memory) technology - as highlighted by Phoronix. This will likely be the the first significant release from HiSilicon in a while but don't get your hopes up as it could also just be a rebranded older model with a slight pinch of HBM.

Intel’s Arrow Lake official memory speeds are unchanged with standard memory sticks — pricier CUDIMM memory needed for faster base spec

The Intel Core Ultra 200S (codenamed Arrow Lake) chip spec sheets note that their maximum JEDEC DRAM speed is DDR5-6400, allowing users to use faster memory speeds without overclocking. However, hardware leaker @harukaze5710 shared some documentation on X that showed that the chips supported the faster standard when using more expensive CUDIMM.