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AMD's Ryzen 9 7845HX and Ryzen 9 7945HX processors are among the fastest gaming CPUs for laptops, and since these are the company's ultra-high-end offerings, they ought to be quite expensive, which somehow limits their adoption by PC makers. In a bid to capture some additional market share, AMD is reportedly prepping Ryzen 9 7840HX and Ryzen 9 7940HX CPUs that will offer similar core count, but will run at slight slower clocks.

Memory makers are witnessing increasing prices as production reductions lead to price rises in both DRAM and NAND segments. Companies like Adata, Phison, and Winbond are experiencing improved revenues in September and Q3, with an overall positive future outlook, reports UDN.com.

Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm fabs as the industry reaches a record high of more than 7.7 million wafers per month, according to SEMI.

Intel this week showcased its 6th Generation Xeon Scalable 'Sapphire Rapids' processors as part of its advanced packaging prowess demonstration. The multi-tile datacenter CPU are due to arrive in the first half of 2024 and the company is sampling them with its customers. Meanwhile, hardware leaker @Yuuki_AnS this week revealed specifications of ES1 samples of these processors.

The Overseas Community Affairs Council (OCAC) released a press statement applauding K. S. Pua, the CEO of Phison Electronics, for his recognition by the American aerospace company Skycorp. This recognition is attributed to Phison's development of a 4TB Solid State Drive (SSD), which underwent testing aboard the International Space Station in 2022 and holds potential for future utilization in NASA's lunar missions.

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Renowned hardware leaker @momomo_us has published what seems to be specifications of AMD's upcoming EPYC 8004-series 'Siena' processors. The new Zen 4-based CPUs are projected to hit the market later this year or early next year and address lower-power servers that may not need the highest performance, such as those used for edge and telecom applications.

Micron was the first company to introduce 24Gb DDR5 memory devices as well as start shipping actual modules on their base last fall. As it turns out, as part of Micron's HBM3 Gen2 announcement, the company wants to maintain the lead and is prepping to mass produce 32Gb DDR5 ICs as well high-capacity memory modules in the first half of 2024, the company revealed today.